产品列表-新型电子陶瓷有限公司

Metalized Ceramics
for Soldering of Electronic Elements and Circuits

金属化陶瓷–用于电子元件和线路的锡焊

Metalized Ceramics for Soldering of Electronic Elements and Circuits

项目 Items	单位 Unit	用于锡焊 for Soldering
作业温度 Operation Temperature	°C	200-400
抗拉强度 Pull-Withstanding	MPa	>=10
润湿性 wettability		>90% (for Tin/Rosin)
打线/点焊 Bonding/Welding	(ø0.14mm copper wire)	>=150gf (no plated layer peel-off )